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Former Guardsman keeps Brewer Science materials "always ready"

rbuschjost.jpgIf Brewer Science production facilities are stocked with all the chemicals and equipment employees need to achieve success, they probably have Ryan Buschjost to thank.

Topics: National Guardsman, process engineer, chemical engineering

Supervisor knows quality in horses, Brewer Science products

tash-1.jpgShe’s an avid horsewoman whose college nickname “Boots” came about via the frequent wearing of her ubiquitous cowboy boots.

Topics: quality, analytical group, quality control

Disciple of degrees: Brewer Science program manager is scholar extraordinaire

Walter BarnesWalter Barnes’ career could have taken a number of different directions before he joined Brewer Science. And if his hugely impressive resume is an indication, he could have excelled in any or all.

Topics: higher education, Brewer Science, management, Walter Barnes

Finding Nano: Where Will DSA Lead Us Next?

In its constant quest to innovate, Brewer Science is continually on the cutting edge of what is next. We are currently combining directed self-assembly (DSA) and lithography to achieve sub–10 nm nanostructures. DSA uses block copolymers to generate arrays of self-assembled shapes such as lines or cylinders; the spatial arrangements of the resulting features can build complex structures for use in products such as cell phones and computer hard drives.

Topics: lithography, Directed Self-Assembly, DSA, Arkema, Nanotechnology

Directed Self-Assembly: From the Top-Down to the Bottom-Up

In previous posts, we’ve made references to Moore’s law and how, with uncanny accuracy, it has predicted that the number of transistors in a dense integrated circuit (IC) would double approximately every two years. The semiconductor industry has tirelessly chased Moore's law ever since it was first coined in the 1970s, but as ICs have become smaller and smaller, traditional lithography processes have made it more and more difficult to keep up.

Topics: Integrated Circuits, Directed Self-Assembly, DSA

Futuristic Approach with Directed Self-Assembly

Now that Brewer Science is leading the charge in improving directed self-assembly (DSA) technology, products such as semiconductors, computer hard drives, and drug therapies can benefit from new manufacturing methods that can make complex structures as small as 7 nanometers. The technology allows for higher product volumes and lower costs than in the past, all without requiring manufacturing equipment upgrades. What’s next for DSA technology across the world? We asked the opinion of Dr. Marya Lieberman, associate professor of chemistry at the University of Notre Dame. Lieberman’s research focuses on nanostructures made from DNA as self-assembling "circuit boards" for nanoelectronic and nanomagnetic devices.

Topics: Directed Self-Assembly, DSA, semiconductors, nano technologies

Brewer Science technology, forecasts highlighted in Chip Scale Review

In recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review.

Topics: debonding materials, advanced packaging, wafer-level packaging, FOWLP

Brewer Science to teach and learn at Tokyo’s SEMICON Japan 2015

Continuing our multi-year tradition, Brewer Science is joining hundreds of other worldwide exhibitors in showcasing our latest technologies Dec. 16–18 at the 38th SEMICON Japan, the largest annual gathering for the semiconductor manufacturing industry.

Topics: Internet of Things, BrewerBOND, SEMICON Japan

Heat and Lateral Force: A Perfectly Complex Debonding Process

As part of its efforts to make devices faster and more efficient, Brewer Science is on the cutting edge of the technology that allows more transistors to fit into the same integrated circuit footprint as in the past.

A 3-D stacking process uses a new bonding material and 300-mm wafer bonders to effectively solve the industry-wide challenge of improving performance without increasing the cost and complexity associated with the development of smaller features. The industry impact of this new process has been compared to that of chemical mechanical polishing (CMP) from years ago. 

Topics: BrewerBOND 220, Heat, Debonding Process, 3D Stacking, Lateral Force

Adhesives: Ultrathin Wafer Production's Little Giant

Anyone who has worked in a fancy restaurant can tell you that the small details make the biggest impact. The food has to be perfect, yes. But even a simple thing such as the way the napkins are folded or how often your water is refilled can make a lasting impression on the patrons. Oftentimes, tiny adjustments can lead to huge changes down the road, and the world of technology manufacturing is no different.

Topics: Corning, BrewerBOND, Adhesives

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